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Brand Name : SensorMicro
Model Number : Apex417W
Certification : ISO9001:2015; RoHS; Reach
Place of Origin : Wuhan, Hubei Province, China
MOQ : 1000 Pieces
Price : Negotiable
Payment Terms : L/C,T/T
Type : Microbolometer
Resolution : 400x300
Material : Vanadium Oxide
Weight : <2g
Pixel Pitch : 17μm
NETD : <40mK
Size : 18x16x2.8mm
Spectral Range : 8~14μm
Apex417W is a Wafer Level Packing (WLP) VOx uncooled focal plane array detector featuring 400x300 resolution with 17μm pixel size.
Wafer level packaging (WLP) represents the smallest, most cost-effective packaging solution, completing high vacuum packaging directly on the entire MEMS wafer before cutting into individual infrared detectors. This streamlined manufacturing process significantly reduces production time and costs.
The Apex417W uncooled LWIR infrared sensor is widely utilized across numerous applications including thermography, security monitoring, firefighting, autonomous driving, and personal vision systems.
| Model | Apex417W |
|---|---|
| Sensitive Material | VOx |
| Package | Wafer-Level |
| Resolution | 400×300 |
| Pixel Size | 17μm |
| Spectral Response | 8μm~14μm |
| NETD | <40mK |
| Output Signal | Built-in 14 bits ADC |
| Thermal Response Time | <12ms |
| Max. Frame Rate | 50Hz |
| Power Consumption | <180mW |
| Size(mm) | 18×16 |
| Weight(g) | <2 |
| Operating Temperature | -40℃~ +85℃ |
High sensitivity and excellent performance - World-leading technology in infrared industry
Various infrared detectors available - Both uncooled and cooled IR detectors in different formats and pixel sizes
Volume production to ensure fast delivery - Three production lines with annual production capability up to millions of detectors
Infrared thermal imaging utilizes infrared radiation and thermal energy to gather information about objects, converting invisible infrared radiation into visible thermal images that display temperature distribution across target surfaces. Different objects and even different parts of the same object exhibit varying radiation abilities and infrared reflection strengths.
A thermal imaging module typically consists of an infrared detector, infrared lens, and hardware electronics with embedded software and algorithms. It represents the minimum functional unit of a thermal imaging device.
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400x300 Resolution 17μm Pixel Pitch Vanadium Oxide Uncooled Infrared Detector FPA Microbolometer Images |